Navitas Semiconductor has expanded its portfolio of SiCPAK power modules with new 1,200-V devices that feature epoxy-resin potting and proprietary trench-assisted planar SiC MOSFET technologies. These ...

ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT ...

Designed to deliver fast, efficient ORing functionality in applications requiring power supply redundancy or parallel ...

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.

The unit measures 2 × 4 × 0.75 inches and delivers a power density of 33 W/in³, enabling significant miniaturization compared ...

In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

‘These technologies enter the market without proper qualification,’ Gebhardt says. Image: Fraunhofer ISE This interview appears alongside others on module reliability in the latest edition of our ...

Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging materials market, driven by the rise of SiC and GaN semiconductors and electric vehicles.

Visit ROHM at APEC 2026 Booth #1443 ROHM will be showcasing its latest technologies for a wide range of applications. Santa ...