A trillion-dollar industry driven by AI and quantum computing, with Zeiss inspection tech and advanced packaging innovations.

Explore OCP Global Summit 2026 breakthroughs: high-voltage 800 V DC-to-12 V power boards, advanced server PSUs, and isolated ...

At Ayar Labs CPO Summit, Meta, Broadcom, AMD, and others weighed in on readiness for a 2028 co-packaged optics demand surge ...

GlobalFoundries secures a $21B U.S.-Japan partnership to build two New York fabs, boosting U.S. chip production by 10% amid ...

Fraunhofer manufactures specialized chips in small volumes that help IMS systems produce photomasks for advanced ...

Automotive executives and AI developers are reassessing the plans to bring automated driving systems to everyday vehicles.

Swissbit and Fraunhofer target Europe’s advanced packaging gap, bridging research and low-volume industrial production.

Track energized compute, not gigawatts, as AI data centers face delays in memory, networking, cooling, and power.

Applied Materials launched its $5B EPIC Center in Silicon Valley to unite chipmakers and accelerate AI semiconductor R&D by ...

Learn how Europe’s Cyber Resilience Act (CRA) forces chipmakers to adopt automated verification tools to prove silicon ...

In a bid to secure domestic deep-tech infrastructure, Qilimanjaro closed €19.6 million (~$21.3 million) funding led by Indra ...

Rohm Semiconductor partners with Tata Electronics and Suchi Semicon to outsource assembly and testing in India, driving local ...