IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Editor’s note: The following white paper is from an IMAPS conference in 2014 in San Diego presented by GaN Systems and AT&S. We were just granted permission to publish this paper. Large GaN ...

Gallium nitride (GaN) is quickly becoming the semiconductor material of choice for both RF/microwave and higher-wavelength devices. It has long been a semiconductor foundation for light-emitting ...