As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the ...

The data connection device under test in Figure 1 is characterized by comparing test signals sent into the link with signals measured at the link output. The differences between these two test signals ...

The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of ...

As the number of higher-throughput applications grows, so does the need for a wider bandwidth and network coverage in wireless systems. Given limited spectrum allocation, wireless communication ...

Sometimes, you only want to analyze those signal components that meet certain criteria or occur at certain times within an acquisition. This is not too difficult for a single acquisition, but what if ...

An industry expert discusses the factors you need to consider when purchasing or creating an EMC test software package. For any of us who have put on a pair of black plastic headphones and plugged ...