The “Special Report—Test Applications” in our January issue focuses on the software tools as well as logic analyzers, protocol analyzers, BERTs, phase-noise testers, spectrum analyzers, vector network ...

With high speed digital designs frequently encountering analog effects, test and measurement experts Dr. Geoff Lawday, David Ireland and Greg Edlund have written a practical guide to help digital ...

Semiconductor testing has traditionally functioned as a stable screening step in the manufacturing flow so that failing devices can be identified and separated prior to packaging. Test infrastructure ...

ANSYS, Inc., (Southpointe, Pennsylvania, USA) has unveiled the version 4.0 release of SIwave software which includes new features for signal-integrity, power-integrity and electromagnetic ...

The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of ...

The transition to HDMI 2.0 was overwhelmingly driven by the urge to support higher resolution signals, notably 4K HDR 4:4:4 with a 600-megapixel flow rate. HDMI 2.0 is furthermore built to accommodate ...

The latest buzz phrase in electronic engineering today is “signal integrity”. That is especially what the test and measurement companies want to help you achieve. And engineers everywhere are trying ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...

Interconnect cables play an important role in electronics testing. As high-speed signal communications continue to advance, cabling solutions will need to keep up with high-speed, multiport testing.

The relentless drive for higher performance and increased functional integration has ushered in new challenges for managing electromagnetic interference (EMI) in densely packed mixed-signal ...

A next-generation board-test system combines structural, parametric, high-speed interconnect, and functional testing to address the growing complexity of AI and data-centre hardware manufacturing.