Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
DuPont is a big proponent of the digital twin, wherein all the elements and dynamics of physical plant assets can be replicated in software for process assessment and optimization and operator ...
How self-tuning can support an adaptive control strategy. How Model Reference Adaptive Control can improve adaptability. The different types of MRAC. A certain amount of flexibility is always good to ...
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