The use of memory-heavy IP in SoCs for automotive, artificial intelligence (AI), and processor applications is steadily increasing. However, these memory-heavy IP often have only a single access point ...

Memory systems have evolved a lot in the previous few years due to advancements in fabrication technology. High Bandwidth Memory (HBM) is an example of the latest kind of memory chips which can ...

The new HBM4E Controller builds on Rambus’s track record of more than 100 HBM design wins and the company’s long-standing focus on memory interface IP. The new controller incorporates advanced ...

SUNNYVALE, Calif., May 21, 2008 – Denali Software, Inc., today, as one of the DDR PHY Interface (DFI) specification participating members including ARM, Denali, Intel, and Samsung, announced the ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update ...

The pace of AI innovation continues to expose a painful reality. Compute keeps scaling, but memory bandwidth remains one of the hardest bottlenecks to remove. As AI models grow larger and more complex ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced sampling [1] of the industry’s first [2] Universal Flash Storage [3] (UFS) embedded flash memory devices ...

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its highly anticipated JESD220H and ...

SUNNYVALE, Calif. — September 05, 2006 - eSilicon Corporation, a leading supplier of custom integrated circuits (ICs), today announced it is offering complete, customized Double-Data Rate 2 (DDR2) ...

High-speed-digital serial I/O links and DDR memory interfaces are presenting significant measurement challenges as fourth-generation standards emerge. As signals travel at ever higher speeds over ...