Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, ...

Panelists repeatedly highlighted that AI compute scaling is dramatically outpacing traditional Moore’s Law transistor ...

Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more ...

At The Next FPGA Platform event in San Jose, California on January 22, Jose Alvarez, Intel PSG CTO, Jose Alvarez outlined the three levels of heterogeneous integration. It’s a simple taxonomy. First, ...

Scientists in NEXT Lab, Tsinghua University have revealed the fabrication and engineering techniques of TMDs and provided a comparative view between TMDs and traditional semiconductors, demonstrating ...

Applied Materials is the largest supplier of technologies for heterogeneous integration (HI). The company’s newest solutions help chipmakers integrate chiplets into advanced 2.5D and 3D packages using ...

Fort Worth, TX. “Moore’s Law is Done and Heterogeneous Integration is Taking Off”—that was the title of a presentation developed by Dave Armstrong and Bill Bottoms and delivered Wednesday by Armstrong ...

3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...

Keeping pace with Moore’s law continues to be challenging and is driving adoption of innovative packaging technologies that support continued system scaling while doing so at lower costs than ...

PISCATAWAY, NJ (BUSINESS WIRE). IEEE has announced the 2019 release of the Heterogeneous Integration Roadmap (HIR), a roadmap to the future of electronics identifying technology requirements and ...

Win Semiconductors (WinSemi), a GaAs foundry, believes that heterogeneous integration will become a crucial technology for interconnects in silicon photonics (SiPh) and compound semiconductors. Save ...