Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

Adtran brings advanced integration to OIF 400ZR+ demo at ECOC 2023 News summary: Showcase of open network architecture features enhanced flexibility and 400ZR+ performance Adtran continues to champion ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

TORONTO, Dec. 11, 2025 /PRNewswire/ - SeQent, a leading provider of industrial alarm notification and plant-floor communication software, and Wunderlich-Malec Engineering, Inc (WME), a nationally ...